Fully automatic high performance zero drain system
Ideal for cleaning middle to high volume of electronic assemblies
Suitable for cleaning high volume of stencils


Defluxing, removing activators and resin residues
Cleaning contamination from handling and board manufacturing
Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, LGA, MELF etc.
Cleaning of power electronics
Cleaning electronic assemblies requiring extra short process time
Cleaning second side misprints on complex assemblies
Cleaning before conformal coating
Cleaning before wire bonding


  • Ultimate cleaning performance
  • Easy operation
  • Zero drain concept
  • Linear direct spray for equal washing
  • Hot air knife direct dry
  • Illuminated glass door chamber for visual process control
  • Quick changover to Twingo – double capacity configuration
  • Wide range of standard and customized PCBA fixtures
  • Clamping for all types of stencils
  • Simple detailed programming
  • Complete datalogging and bar code traceability
  • Up to 3 fully separated liquid loops
  • Low consumption of chemicals and water
  • Outstanding options of water utilization
  • Adaptive rinse water quality control
  • Automatic chemical concentration control