Zestron VIGON® PE 180 Power Module Cleaning

Aqueous-based, pH neutral defluxing agent for power modules, LEDs, leadframes, and discrete devices

VIGON® PE 180, based on the MPC® Technology (Micro Phase Cleaning), is an aqueous-based, pH neutral cleaning agent specifically developed for the use in spray-in-air equipment.

VIGON® PE 180 removes flux residues from leadframes, discrete devices, power modules, and power LEDs following die attach and/or heatsink soldering. The cleaning agent easily removes oxide layers from copper surfaces to prepare for subsequent processes such as wire/adhesive bonding and molding.

Advantages compared to other cleaners:

• The pH neutral formulation results in stain-free activated copper surfaces for subsequent processes such as wire bonding (gold and aluminum), molding and adhesive bonding
• Its pH neutral formulation results in excellent material compatibility, specifically with power modules and die surface passivation
• Easily rinsed yielding a wide process window
• Retains activated copper surfaces over an extended period of time without risk of reoxidation
• No need for waste water neutralization
• Halogen free