+353 45 889529 
info@maxem.ie
Maxem are pleased to offer the latest Automated Optical Inspection Solutions.
3D SPI Icon series
Magic-ray 3D SPI – Icon series are designed for precise 3D solder paste inspection following SMT screen printing, ensuring high-quality results.
Product Features
- High accuracy: Intelligent zero reference point technology ensures accurate measurement, especially for PCB board deformation.
- High performance: Perfect combination of 3D and color-featured algorithm ensures effective detection on solder bridging, solder breakage, icicle, etc.
- High speed: Flexible choices of multiple optical options, with industry-leading inspection speed and performance.
- Strong Anti-jamming. Effectively detects PCB color variations and automatically adjusts inspection parameters for black and white boards.
- Fast programming can be achieved with/without Gerber.
- Process optimization: SPC data analysis helps to improve process quality.
3D AOI Cube series
3D AOI – Cube Series boasts cutting-edge positioning technology and advanced feature analysis algorithms, making it ideal for high-speed, high-precision inspections of SMT components in SMT pre-reflow and post-reflow processes. The Cube Series eliminates shadow blind spots and accurately captures 3D component shapes for optimal results with its state-of-the-art multi-fringe projection technique.
Product Features
- Rich algorithm – The combination of 3D, AI, and color feature algorithms optimizes the defect detection rate.
- Multiple positioning methods – Precisely locates components, compensates for board warpage, and detects defects on black components on black boards.
- Adaptive detection – Detects both black and white PCBs effectively.
- High-speed inspection – Marble platform, dual-drive, and motion control card ensure industry-leading inspection speeds.
- Ultra-high range 3D reconstruction – Measures components up to 35mm in height.
- Advanced defect analysis – Three-point check software and SPC data analysis quickly identify the root cause of defects.
Wave Soldering AOI VS7300 series
Magic-ray double-sided 3D AOI——VS7300 series, carried with a brand new optical imaging system, for realistic and efficient reconstruction of 3D images of components, are widely suitable for post wave soldering and double-sided final inspection.
Product Features
- Synchronous positioning of upper and lower parts, asynchronous interlocking for image retrieval, and simultaneous completion of double-sided detection to avoid interference from lighting, saving factory space.
- Equipped with high-speed industrial cameras and motion control cards, achieving industry-leading inspection speed and stability.
- Ultra-high measurement range and clearance, coupled with dual-sided Z-axes, suitable for wave soldering production lines, effective inspection of THT floating height defects.
- Rich feature algorithms: 3D+AI+color extraction, flexibly satisfy SMT and THT Inspection demands.
- Specialized algorithm for dip soldering joint: accurate measurement of pin height, and effective inspection of defects like missing pins or no protrusion leads.
Conformer Coating AOI VC5000/VC5100/VC5300 series
Magic-ray Conformal Coating AOI are suitable for inline single: VC5000/VC5100, / double-sided: VC5300, automatic inspection of conformal coating.
Product Features
- Usage of high-brightness UV lighting, easily distinguishes the coating containing phosphor.
- Support intelligent programming of detection areas across FOV and of components across CAD, adaptive to multiple inspection scenarios.
- Support Single-side or Double-side inline automatic inspection of conformal coating.
- Coating Thickness Measurement is optional, realizing real-time high-precision thickness measurement.
- Optional intelligent AI algorithm optimizes detection on bubble defects.
Underfill Adhesive AOI VF5100/VF5300 series
Magic-Ray’s Underfill Adhesive AOI VF5100 (Single-side), VF5300 (Double-sided)—Suitable for the proportion inspection of climbing height of Underfill adhesive (UF adhesive) on the side of the component. They are compatible with different types of adhesive detection: UV adhesive, RTV adhesive, heat dissipation adhesive, etc., as well as normal component inspection.
Product Features
- Five-sided inspection, with full coverage around the components.
- Automatically draw side adhesive contour lines to clearly distinguish adhesive boundaries.
- Slide mouse to view the percentage of climbing height at any position of the side of the component
- Save images of five sides and test data to facilitate process review.
- Optional thickness measurement function to achieve inline measurement of adhesive thickness.
Semiconductor Mounting AOI SD5000 series
Magic-Ray Mounting AOI—SD5000 series, are suitable for complex substrate inspection before bonding to ensure the bonding yield. Semiconductor Mounting AOI /Chip & Substrate Scratch Inspection Expert.
Product Features
- Marble platform and high-resolution telecentric lens are applied to ensure high precision.
- 6-channel multi-angle programmable lighting, can be flexibly matched to amplify defect features.
- Intelligent recognition of gold fingers and substrate areas to enable inspection of any position on the substrate.
- Powerful algorithms allow for strong gold finger scratch and yellowing inspection capabilities.
- Multi-layer positioning algorithm can cope with board bending deformation, with vacuum adsorption option available.
- Can be collocated with loader and unloader for offline inspection.
Semiconductor Bounding AOI SW6000 series
Magic-Ray wire bonding AOI — SW6000 utilizes 3D structured light for the third-order optical inspection of semiconductors and lead wires (2mil and up). Features rapid post wire bonding defect testing and precision inspection, as well as advanced functionalities for rapid programming, defect annotation, and data storage.
Product Features
- Designed for power component packaging post-die and wire bonding defect detection.
- Combined 2D camera & 3D structured light image capture for rapid inspection.
- Compatible with conveyor track to allow for inline testing and features offline testing with automatic loading and unloading.
- AI-powered smart programming vastly improves programming efficiency.
- Completely offline programming capabilities – debugging without stopping production.
- Flexible lighting and adjustable Z-axis easily handle complicated inspection situations.
- Links with MES systems, supports TCP/IP, SECS/GEM communication protocols, and more.
- Advanced SPC capabilities support data review and process analysis.
Mini LED AOI
Magic-ray Mini LED AOI – VD5000 series is able to provide chip appearance inspection, lighting inspection and Lens glue appearance inspection solution in the field of Mini LED.
Product Features
- Suitable for the Pre-and-Post reflow appearance inspection of Mini LED direct-display products, as well as the after-lighting detection of direct-display products.
- Suitable for the Pre-and-Post reflow appearance inspection of backlight products, as well as the appearance inspection of Lens glue.
- Granite platform + casting gantry to realize high reliability and stability.Industrial camera + high resolution telecentric lens to ensure high accuracy.
- Accurate positioning and detection based on image-featured algorithm with low false call rate.
- Applicable to the appearance detection of chips at minimum of 3*5 mil.
- Applicable to test up to 100,000 chips.
Call us today on +353 45 889529 or email info@maxem.ie to speak to one of our team