Viscom – Solutions and systems for all the electronics industry’s inspection tasks

Viscom develops, manufactures and sells high-quality inspection systems. The product portfolio encompasses the complete bandwidth of optical and X-ray inspection operations, especially in the area of electronics assemblies. Viscom systems are used whenever 100 % automatic inspection of electronics assemblies is required, such as in the production of automotive electronics, aerospace technology and industrial electronics. The objective is a flawless product for the customer and efficient process control. Viscom is a one of the leading suppliers in this segment.

Inspection systems for Electronics Manufacturing

  • European market leader in SMT inspection
  • First choice supplier for demanding automotive electronics
  • Over 30 years’ experience of PCB inspection
  • R & D, manufacture and support based in Hannover, Germany

Areas of Expertise

Solder paste inspection (3D SPI)

• 3D inspection of paste features such as volume, displacement, form etc.
• 3D sensor head with fringe projection method
• Highest inspection depth to 200 cm²/s
• Full process control through Viscom Quality Uplink

Automatic Optical Inspection (3D AOI) – Post-reflow

• Fast, versatile 3D sensor
• Ultra-high-resolution cameras with resolution up to 8 µm
• Extremely high throughput
• Solder joint inspection (3D, 2.5D, 2D)

Automatic X-ray inspection (3D AXI) – Post-reflow

• Inline inspection of hidden defects with miniature bodies such as µBGA
• Solder joint inspection (3D, 2.5D, 2D)
• Microfocus X-ray tube (3D, 2.5D, 2D) with resolution up to 5 µm
• Checking assembly elements

Manual X-ray inspection (3D MXI)

• Random sample analysis and non-standard inspection
• 3D reconstruction through computed tomography
• Inspection of hidden defects in miniature bodies such as µBGA and CSP
• Inline compatible